● Iinkonzo Zethu: I-PCB ene-One-stop kunye ne-PCBA yeenkonzo zokwenza i-elektroniki
● Inkonzo yokuvelisa i-PCB: Kufuneka ifayile yeGerber (CAM350 RS274X), iifayile zePCB (Protel 99, AD, Eagle), njl.
● Iinkonzo zokufumana izixhobo zamacandelo: Uluhlu lwe-BOM lubandakanya inombolo yeCandelo elineenkcukacha kunye noMyili
● Iinkonzo zokudityaniswa kwePCB: Ezi fayile zingentla kwaye Khetha kwaye ubeke iifayile, umzobo wendibano
● Iinkonzo zokuCwangcisa kunye noVavanyo: Inkqubo, introuction kunye nendlela yokuvavanya njl.
● Iinkonzo zendibano yezindlu: Iifayile ze-3D, inyathelo okanye ezinye
● Ukubuyisela umva iinkonzo zobunjineli: Iisampuli kunye nabanye
● Iinkonzo zokudityaniswa kwentambo kunye neengcingo: Ukucaciswa kunye nezinye
● Ezinye iinkonzo: Iinkonzo ezongeziweyo zexabiso
UbuGcisa bePCB
| Iileya | Ukuveliswa kobuninzi: I-2 ~ 58 imigangatho / Umqhubi we-Pilot: i-64 layers |
| Max.Ukutyeba | Ukuveliswa kobunzima: 394mil (10mm) / Umqhubi womqhubi: 17.5mm |
| Izinto eziphathekayo | I-FR-4 (i-Standard FR4, i-Mid-Tg FR4, i-Hi-Tg FR4, i-Lead free assembly material) , i-Halogen-Free, i-Ceramic egcweleyo, i-Teflon, i-Polyimide, i-BT, i-PPO, i-PPE, i-Hybrid, i-Hybrid hybrid, njl njl. |
| Min.Ububanzi/Isithuba | Umaleko wangaphakathi: 3mil/3mil (HOZ), Umaleko wangaphandle: 4mil/4mil(1OZ) |
| Max.Ukutyeba kobhedu | Isiqinisekiso se-UL: 6.0 OZ / Umqhubi wePilot: 12OZ |
| Min.Ubungakanani bomngxuma | Uqheliso lukamatshini: 8mil(0.2mm) I-Laser drill: 3mil(0.075mm) |
| Max.Ubungakanani bephaneli | 1150mm × 560mm |
| Umgangatho wento | 18:1 |
| Umphezulu Gqiba | HASL,Igolide yokuntywiliselwa, iTin yokuntywiliselwa, iOSP, ENIG + OSP, iSilver yokuntywiliselwa, iENEPIG, uMnwe weGolide |
| Inkqubo ekhethekileyo | Umngxuma oGqwebileyo, umngxuma oyimfama, ukuxhathisa okuThunyiweyo, amandla aHlangeneyo, iHybrid, ingxubevange engaphelelanga, ingxinano ephezulu ngokuyinxenye, ukugrumba ngasemva, kunye nolawulo lokuxhathisa |
UbuGcisa bePCB
| SMT | Ukuchaneka kwesikhundla: 20 um |
| Ubungakanani bamacandelo:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP | |
| Max.ubude becandelo::25mm | |
| Max.PCB ubukhulu: 680×500mm | |
| Min.Ubungakanani bePCB:akukho mda | |
| PCB ubukhulu:0.3 ukuba 6mm | |
| PCB ubunzima:3KG | |
| Wave-Solder | Max.PCB ububanzi: 450mm |
| Min.PCB ububanzi: akukho mda | |
| Ubude becandelo: Phezulu 120mm/Bot 15mm | |
| Ssweat-Solder | Uhlobo lwentsimbi: inxalenye, yonke, inlay, sidestep |
| Izinto zentsimbi: Ubhedu, iAluminiyam | |
| Ukugqitywa komphezulu: ukucwenga i-Au, i-plating sliver, i-plating Sn | |
| Umoya wesinyi: ngaphantsi kwe-20% | |
| Cinezela-ngena | Uluhlu lweendaba: 0-50KN |
| Max.Ubungakanani bePCB: 800X600mm | |
| Uvavanyo | I-ICT,Cwangcisa ukubhabha, ukutshisa ngaphakathi, uvavanyo lomsebenzi, ukukhwela ibhayisekile lobushushu |
