Enye stop electronic Server PCBA umenzi webhodi

Enye stop electronic Server PCBA ibhodi umenzi Featured Image

Inkonzo yethu:

Ngokuphuhliswa kwedatha enkulu, i-computing yefu kunye nonxibelelwano lwe-5G, kukho amandla amakhulu kwi-server / imboni yokugcina.Iiseva zibonakaliswe ngekhono eliphezulu le-CPU yekhompyutha, ukusebenza okuthembekileyo kwexesha elide, i-I / O enamandla yangaphandle yokuphatha idatha kunye nokwandiswa okungcono.I-Suntak Technology izimisele ukubonelela ngeebhodi zesantya esiphezulu kunye neebhodi eziphezulu ze-multi-layer ezinokuthembeka okuphezulu, ukuzinza okuphezulu kunye nobuchule obuphezulu bokunyamezela okufunekayo kumgangatho womncedisi.

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Iithegi zeMveliso

Products feature

● Umbandela: Fr-4

● Ukubalwa koMaleko: Imigangatho emi-6

● PCB Ukutyeba: 1.2mm

● Umz.Umkhondo / Indawo yangaphandle: 0.102mm/0.1mm

● Umz.Umngxuma ogrunjiweyo: 0.1mm

● NgeNkqubo: UkuTenta ngeVias

● Ukugqitywa komphezulu: ENIG

Iimpawu zesakhiwo sePCB

1. Isekethe kunye nepateni (iPattern): Isekethe isetyenziswa njengesixhobo sokuqhuba phakathi kwamacandelo.Kuyilo, indawo enkulu yobhedu iya kuqulunqwa njengesiseko kunye nomgangatho wokubonelela ngamandla.Imigca kunye nemizobo yenziwa ngaxeshanye.

2. Umngxuma (Throughole/via): Umngxuma odlulayo unokwenza imigca engaphezulu kwamanqanaba amabini iqhube enye kwenye, eyona inkulu isetyenziswa njengeplagi yecandelo, kwaye umngxuma ongeyo-conductive (nPTH) udla ngokusetyenziswa. njengomphezulu Ukunyuka kunye nokubekwa, kusetyenziselwa ukulungisa izikrufu ngexesha lokuhlanganisa.

3. I-inki ekwazi ukumelana ne-Solderresistant (i-Solderresistant/SolderMask): Ayizizo zonke iindawo zobhedu ekufuneka zitye iinxalenye zetoti, ngoko ke indawo engatyiwayo iya kuprintwa kunye nomaleko wezinto (ngokuqhelekileyo i-epoxy resin) eyahlula umphezulu wobhedu ekutyeni itoti ukuya. kuphephe non-soldering.Kukho umjikelo omfutshane phakathi kwemigca etotiweyo.Ngokweenkqubo ezahlukeneyo, ihlulwe ibe yioli eluhlaza, ioli ebomvu kunye neoli eluhlaza okwesibhakabhaka.

4. I-Dielectric layer (i-Dielectric): Isetyenziselwa ukugcina i-insulation phakathi kwemigca kunye nemigangatho, eyaziwa ngokuba yi-substrate.

PCBA Ubuchule bobugcisa

SMT	Ukuchaneka kwesikhundla: 20 um
	Ubungakanani bamacandelo:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
	Max.ubude becandelo::25mm
	Max.PCB ubukhulu: 680×500mm
	Min.Ubungakanani bePCB:akukho mda
	PCB ubukhulu:0.3 ukuba 6mm
	PCB ubunzima:3KG
Wave-Solder	Max.PCB ububanzi: 450mm
	Min.PCB ububanzi: akukho mda
	Ubude becandelo: Phezulu 120mm/Bot 15mm
Ssweat-Solder	Uhlobo lwentsimbi: inxalenye, yonke, inlay, sidestep
	Izinto zentsimbi: Ubhedu, iAluminiyam
	Ukugqitywa komphezulu: ukucwenga i-Au, i-plating sliver, i-plating Sn
	Umoya wesinyi: ngaphantsi kwe-20%
Cinezela-ngena	Uluhlu lweendaba: 0-50KN
Cinezela-ngena	Max.Ubungakanani bePCB: 800X600mm
Uvavanyo	I-ICT,Cwangcisa ukubhabha, ukutshisa ngaphakathi, uvavanyo lomsebenzi, ukukhwela ibhayisekile lobushushu