Umncedisi wombane we-PCBA umenzi webhodi
Products feature
● Umbandela: Fr-4
● Ukubalwa koMaleko: Imigangatho emi-6
● PCB Ukutyeba: 1.2mm
● Umz.Umkhondo / Indawo yangaphandle: 0.102mm/0.1mm
● Umz.Umngxuma ogrunjiweyo: 0.1mm
● NgeNkqubo: UkuTenta ngeVias
● Ukugqitywa komphezulu: ENIG
Iimpawu zesakhiwo sePCB
1. Isekethe kunye nepateni (iPattern): Isekethe isetyenziswa njengesixhobo sokuqhuba phakathi kwamacandelo.Kuyilo, indawo enkulu yobhedu iya kuqulunqwa njengesiseko kunye nomgangatho wokubonelela ngamandla.Imigca kunye nemizobo yenziwa ngaxeshanye.
2. Umngxuma (Throughole/via): Umngxuma odlulayo unokwenza imigca engaphezulu kwamanqanaba amabini iqhube enye kwenye, eyona inkulu isetyenziswa njengeplagi yecandelo, kwaye umngxuma ongeyo-conductive (nPTH) udla ngokusetyenziswa. njengomphezulu Ukunyuka kunye nokubekwa, kusetyenziselwa ukulungisa izikrufu ngexesha lokuhlanganisa.
3. I-inki ekwazi ukumelana ne-Solderresistant (i-Solderresistant/SolderMask): Ayizizo zonke iindawo zobhedu ekufuneka zitye iinxalenye zetoti, ngoko ke indawo engatyiwayo iya kuprintwa kunye nomaleko wezinto (ngokuqhelekileyo i-epoxy resin) eyahlula umphezulu wobhedu ekutyeni itoti ukuya. kuphephe non-soldering.Kukho umjikelo omfutshane phakathi kwemigca etotiweyo.Ngokweenkqubo ezahlukeneyo, ihlulwe ibe yioli eluhlaza, ioli ebomvu kunye neoli eluhlaza okwesibhakabhaka.
4. I-Dielectric layer (i-Dielectric): Isetyenziselwa ukugcina i-insulation phakathi kwemigca kunye nemigangatho, eyaziwa ngokuba yi-substrate.
PCBA Ubuchule bobugcisa
SMT | Ukuchaneka kwesikhundla: 20 um |
Ubungakanani bamacandelo:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP | |
Max.ubude becandelo::25mm | |
Max.PCB ubukhulu: 680×500mm | |
Min.Ubungakanani bePCB:akukho mda | |
PCB ubukhulu:0.3 ukuba 6mm | |
PCB ubunzima:3KG | |
Wave-Solder | Max.PCB ububanzi: 450mm |
Min.PCB ububanzi: akukho mda | |
Ubude becandelo: Phezulu 120mm/Bot 15mm | |
Ssweat-Solder | Uhlobo lwentsimbi: inxalenye, yonke, inlay, sidestep |
Izinto zentsimbi: Ubhedu, iAluminiyam | |
Ukugqitywa komphezulu: ukucwenga i-Au, i-plating sliver, i-plating Sn | |
Umoya wesinyi: ngaphantsi kwe-20% | |
Cinezela-ngena | Uluhlu lweendaba: 0-50KN |
Max.Ubungakanani bePCB: 800X600mm | |
Uvavanyo | I-ICT,Cwangcisa ukubhabha, ukutshisa ngaphakathi, uvavanyo lomsebenzi, ukukhwela ibhayisekile lobushushu |
Ngokuhambela phambili ngokukhawuleza kwetekhnoloji kunye nokwanda kwemfuno yokusetyenzwa kwedatha ngesantya esiphezulu, iseva/ishishini lokugcina lifumana i-boom emangalisayo.Kukho imfuno eyandayo yeeseva ezinamandla amakhulu ekhompyuter e-CPU, ukusebenza okuthembekileyo, ukusetyenzwa kwedatha okusebenzayo kwangaphandle, kunye nokulinganisa okugqwesileyo.Ngeli xesha ledatha enkulu, i-computing yefu kunye nonxibelelwano lwe-5G, singumenzi webhodi webhodi ye-elektroniki ye-PCBA yokukhawulelana nezi mfuno zikhulayo.
Saziwa ngokuzinikela kwethu ekuhambiseni umgangatho ophezulu, iibhodi zeseva ezisebenza kakhulu.Iibhodi zethu zoomama ziyilelwe ukwandisa amandla e-CPU, ukuqinisekisa ukuba akukho mthungo kunye nombane okhawulezayo kwikhompyuter.Siyakuqonda ukubaluleka kokusebenza okuthembekileyo kwexesha elide kushishino lweeseva, yiyo loo nto ii-motherboards zethu zivavanywa ngokuqatha kunye neprothokholi zokuqinisekisa umgangatho ukuqinisekisa ukusebenza ngokupheleleyo kunye nokuqina.
Enye yezinto eziphawulekayo kwiibhodi zethu ze-motherboards yi-I/O yabo enamandla yangaphandle yokucwangcisa idatha.Siyayiqonda indima ebalulekileyo edlalwa yidatha kwimekobume yedijithali yanamhlanje, kwaye iibhodi zethu ze-motherboard zenziwe ukuba zikwazi ukuphatha izixa ezikhulu zedatha ngobuchule obungalinganiyo.Nokuba kukugcinwa kwedatha, ukuhanjiswa kwedatha okanye ukusetyenzwa kwedatha, iibhodi zethu zoomama zibonelela ngeempawu ezikumgangatho ophezulu ukuhlangabezana neemfuno ezihlala zikhula zeenkqubo zeeseva zale mihla.
Ukongeza, ii-motherboards zethu ze-server ziyilwe ngokulinganisa okungcono engqondweni.Siyayiqonda imfuneko yokuguquguquka kunye nokulinganisa kwiinkqubo zeseva kumashishini kunye nemibutho.Iibhodi zethu zoomama zixhotyiswe ngetekhnoloji yokusika kwaye zinokudibanisa ngokulula amanye amacandelo kunye neemodyuli.Oku kuqinisekisa ukuba abathengi bethu banokwandisa ngokukhawuleza umthamo wabo weseva njengoko iimfuno zabo zikhula ngaphandle kokubeka esichengeni ukusebenza okanye ukuthembeka.
Siyazingca ngokuthembeka okuphezulu, ukuzinza kunye nokunyamezela iimpazamo.Siyazi ukuba iinkqubo zeseva zihlala zisebenza phantsi komthwalo onzima kunye neemeko ezinzima.Yiyo loo nto iibhodi zethu zenziwe ngezinto ezomeleleyo kwaye zithobela imigangatho yomgangatho ongqongqo, ukubonelela ngokuthembeka okuphezulu kunye nokuzinza nakwimimandla enzima kakhulu.Ngoyilo lwethu olunokunyamezela iimpazamo, ukuba kunokwenzeka nayiphi na imiba engalindelekanga, iibhodi zethu ze-motherboard zenziwe ngobunjineli ukuqinisekisa ukusebenza okungaphazamisekiyo kunye nokunciphisa ixesha lokuphumla.
Lilonke, sibe lukhetho lokuqala kumashishini kunye nemibutho ekhangela isantya esiphezulu, esithembekileyo kunye neebhodi zeseva ezisebenza ngeendlela ezahlukeneyo.Sizibophelele ekugqweseni kunye nokwaneliseka kwabathengi, sizama ukubonelela ngeemveliso ezikumgangatho ophezulu ezenza ukuba abathengi bethu baqonde amandla apheleleyo eenkqubo zeseva zanamhlanje.Sebenzisana nathi ukuze ufumane amanqanaba amatsha okusebenza kweseva kwaye usebenzise amathuba amangalisayo aboniswe yidatha enkulu, i-computing yefu kunye ne-5G yonxibelelwano.