Umenzi unxibelelwano Umncedisi wePCB Board PCB Assembly Manufacture

Umenzi unxibelelwano Iseva PCB Ibhodi PCB Assembly Manufacture Featured Image

Inkonzo yethu:

Siyavuya ukwazisa imveliso yethu yamva nje, uMenzi woNxibelelwano lwe-PCB yeBhodi ye-PCB yoMvelisi weNdibano.Itekhnoloji yethu ephezulu, izixhobo ezisemgangathweni kunye noyilo oluyilayo lusenza sahluke kwabo sikhuphisana nabo kolu shishino.Le mveliso yenzelwe ukuguqula iiseva zonxibelelwano kunye nokwandisa uqhagamshelo kwiinkqubo ezahlukeneyo zemizi-mveliso.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

Products feature

● Umbandela: Fr-4

● Ukubalwa koMaleko: Imigangatho emi-6

● PCB Ukutyeba: 1.2mm

● Umz.Umkhondo / Indawo yangaphandle: 0.102mm/0.1mm

● Umz.Umngxuma ogrunjiweyo: 0.1mm

● NgeNkqubo: UkuTenta ngeVias

● Ukugqitywa komphezulu: ENIG

Iimpawu zesakhiwo sePCB

1. Isekethe kunye nepateni (iPattern): Isekethe isetyenziswa njengesixhobo sokuqhuba phakathi kwamacandelo.Kuyilo, indawo enkulu yobhedu iya kuqulunqwa njengesiseko kunye nomgangatho wokubonelela ngamandla.Imigca kunye nemizobo yenziwa ngaxeshanye.

2. Umngxuma (Throughole/via): Umngxuma odlulayo unokwenza imigca engaphezulu kwamanqanaba amabini iqhube enye kwenye, eyona inkulu isetyenziswa njengeplagi yecandelo, kwaye umngxuma ongeyo-conductive (nPTH) udla ngokusetyenziswa. njengomphezulu Ukunyuka kunye nokubekwa, kusetyenziselwa ukulungisa izikrufu ngexesha lokuhlanganisa.

3. I-inki ekwazi ukumelana ne-Solderresistant (i-Solderresistant/SolderMask): Ayizizo zonke iindawo zobhedu ekufuneka zitye iinxalenye zetoti, ngoko ke indawo engatyiwayo iya kuprintwa kunye nomaleko wezinto (ngokuqhelekileyo i-epoxy resin) eyahlula umphezulu wobhedu ekutyeni itoti ukuya. kuphephe non-soldering.Kukho umjikelo omfutshane phakathi kwemigca etotiweyo.Ngokweenkqubo ezahlukeneyo, ihlulwe ibe yioli eluhlaza, ioli ebomvu kunye neoli eluhlaza okwesibhakabhaka.

4. I-Dielectric layer (i-Dielectric): Isetyenziselwa ukugcina i-insulation phakathi kwemigca kunye nemigangatho, eyaziwa ngokuba yi-substrate.

PCBA Ubuchule bobugcisa

SMT	Ukuchaneka kwesikhundla: 20 um
	Ubungakanani bamacandelo:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
	Max.ubude becandelo::25mm
	Max.PCB ubukhulu: 680×500mm
	Min.Ubungakanani bePCB:akukho mda
	PCB ubukhulu:0.3 ukuba 6mm
	PCB ubunzima:3KG
Wave-Solder	Max.PCB ububanzi: 450mm
	Min.PCB ububanzi: akukho mda
	Ubude becandelo: Phezulu 120mm/Bot 15mm
Ssweat-Solder	Uhlobo lwentsimbi: inxalenye, yonke, inlay, sidestep
	Izinto zentsimbi: Ubhedu, iAluminiyam
	Ukugqitywa komphezulu: ukucwenga i-Au, i-plating sliver, i-plating Sn
	Umoya wesinyi: ngaphantsi kwe-20%
Cinezela-ngena	Uluhlu lweendaba: 0-50KN
Cinezela-ngena	Max.Ubungakanani bePCB: 800X600mm
Uvavanyo	I-ICT,Cwangcisa ukubhabha, ukutshisa ngaphakathi, uvavanyo lomsebenzi, ukukhwela ibhayisekile lobushushu

Umenzi woNxibelelwano lwe-Server ye-PCB yeBhodi ye-PCB Assembly Manufacturer ine-state-of-the-art yoyilo oluqinisekisa unxibelelwano olungenamthungo kunye noqhagamshelwano.Imveliso ixhotyiswe ngamacandelo e-hardware ye-state-of-art, kubandakanywa iiprosesa eziphezulu zokusebenza, iimodyuli zememori kunye ne-interfaces yenethiwekhi.Iqela lethu leengcali ziye zayila ngononophelo le bhodi yePCB ukuhlangabezana neyona migangatho iphezulu yoshishino kunye nokuhambisa ukusebenza okuphezulu.

Inkqubo yokwenziwa kwendibano yePCB ibandakanya amanyathelo aphambili aliqela, kubandakanywa ukukhangela icandelo, ukunyuswa komphezulu, kunye nesoldering.Amagcisa ethu anezakhono kunye noomatshini abaphambili baqinisekisa indibano echanekileyo yebhodi nganye yePCB, ukuqinisekisa ukusebenza okuthembekileyo nokusebenzayo.Sithatha amanyathelo angqongqo okulawula umgangatho ukunciphisa umngcipheko weziphene kwaye siqinisekise ukuba abathengi bethu bafumana kuphela ezona mveliso zibalaseleyo.

Enye yeempawu ezibalaseleyo zoMvelisi wethu woNxibelelwano lwe-PCB yeBhodi ye-PCB uMvelisi weNdibano yoMenzi wayo obalaseleyo.Imveliso ibonakalisa uyilo lwemodyuli enokuthi yenziwe lula kwaye yandiswe.Iyakwazi ukuziqhelanisa neemfuno ezahlukeneyo zeseva yonxibelelwano kwaye ibe sisisombululo sehlabathi kumashishini ahlukeneyo.Ukongeza, iibhodi zethu zePCB ziyilelwe ukuba zidityaniswe lula kwiinkqubo ezikhoyo, ukunciphisa ixesha lokuphumla kunye nokwandisa imveliso.

Ukuzinikela kwethu ekuveliseni iimveliso ezihambelana nokusingqongileyo kubonakaliswe kuMvelisi woNxibelelwano lwe-PCB Board PCB Assembly Manufacturing.Sibeka phambili ukusebenza kakuhle kwamandla kunye nozinzo kuzo zonke iinkqubo zethu zokuvelisa, siqinisekisa ukuba iimveliso zethu zithobela imigangatho yokusingqongileyo yehlabathi.Ngokukhetha iibhodi zethu ze-PCB, abathengi abaxhamli kuphela kwizakhono zonxibelelwano oluphambili kodwa banegalelo kwikamva eliluhlaza.

Siyakuqonda ukubaluleka kokuthembeka kunye nokuqina kwishishini leseva yonxibelelwano.Yiyo loo nto ibhodi yoNxibelelwano yoMvelisi ye-PCB yeBhodi ye-PCB yeNdibano yokwenziwa kwezixhobo iphantsi kweenkqubo zovavanyo olungqongqo ukuqinisekisa ukomelela kunye nokuphila ixesha elide.Iyakwazi ukumelana neemeko zokusebenza ezinzima, kubandakanywa utshintsho lobushushu, ukungcangcazela kunye nokuguquguquka kombane.Iimveliso zethu zakhiwe ukuba zihlale, ukunciphisa iindleko zokugcinwa kunye nokwandisa ixesha eliphezulu.

Umenzi woNxibelelwano lwe-PCB Ibhodi ye-PCB Assembly Manufacturing sisisombululo somdlalo-ukutshintsha okwenzelwe ukuthatha iiseva zonxibelelwano kwiindawo eziphakamileyo.Ukunikezela ngokusebenza okuphezulu, ukulinganisa, ukuzinza kunye nokuqina, le mveliso lukhetho olufanelekileyo kumashishini afuna uqhagamshelwano oluthembekileyo nolusebenzayo.Thembela kubuchule bethu kwaye ukhethe iimveliso zethu ukuze uvule amandla onxibelelwano angenamthungo kunye nophuculweyo kwimisebenzi yakho yeshishini.

Ngaphambili: INkonzo yeBhodi yeSekethe PCB PCBA yoKhuseleko lweKhamera yeKhaya yeSibonelelo soMvelisi woMbane

Okulandelayo: Car Vehicle GPS Tracking System PCBA Tracking Mini Gps Tracker Pcba Electronic Assembly

Bhala umyalezo wakho apha kwaye uwuthumele kuthi