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Ibhodi yeKhompyutha kunye neeperipherals PCBA

Computer kunye Peripherals PCBA ibhodi Featured Umfanekiso
  • Ibhodi yeKhompyutha kunye neeperipherals PCBA

Inkonzo yethu:

Iiplatform zekhompyutha ziqhubeka zikhula ngokubhekiselele kwisantya, amandla kunye nokugcinwa kolwazi / ukutshintshiselana.Imfuno ye-computing yefu, idatha enkulu, imidiya yoluntu, ukuzonwabisa kunye nezicelo zeselula ziyaqhubeka zikhula kwaye ziqhuba imfuno yolwazi olungakumbi ngexesha elifutshane.


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Products feature

● -Izinto eziphathekayo: Fr-4

● -Ukubalwa koMaleko: Iileya ezili-14

● -PCB Ukutyeba: 1.6mm

● -Umz.Umkhondo / Indawo yangaphandle: 4/4mil

● -Umz.Umngxuma ogrunjiweyo: 0.25mm

● -Ngenkqubo: Tenting Vias

● -Ukuphela komphezulu: ENIG

Iimpawu zesakhiwo sePCB

1. I-inki ekwazi ukumelana ne-Solderresistant (i-Solderresistant/SolderMask): Ayizizo zonke iindawo zobhedu ekufuneka zitye iindawo zetoti, ngoko ke indawo engatyiwayo iya kuprintwa kunye nomaleko wezinto (ngokuqhelekileyo i-epoxy resin) eyahlula umphezulu wobhedu ekutyeni itoti ukuya. kuphephe non-soldering.Kukho umjikelo omfutshane phakathi kwemigca etotiweyo.Ngokweenkqubo ezahlukeneyo, ihlulwe ibe yioli eluhlaza, ioli ebomvu kunye neoli eluhlaza okwesibhakabhaka.

2. I-Dielectric layer (i-Dielectric): Isetyenziselwa ukugcina i-insulation phakathi kwemigca kunye nemigangatho, eyaziwa ngokuba yi-substrate.

3. Unyango lwe-surface (i-SurtaceFinish): Ekubeni indawo yobhedu i-oxidized ngokulula kwindawo eqhelekileyo, ayikwazi ukutshizwa (i-solderability embi), ngoko ke umphezulu wobhedu oza kukhuselwa uya kukhuselwa.Iindlela zokukhusela ziquka i-HASL, i-ENIG, i-Immersion Silver, i-TIn yokuntywila, kunye ne-organic solder preservative (OSP).Indlela nganye ineenzuzo zayo kunye nokungonakali, ngokudibeneyo ekubhekiselwa kuyo njengonyango lomphezulu.

SFSdvd (1)
SFSdvd (2)

Ubuchule bePCB bobuGcisa

Iileya Ukuveliswa kobuninzi: I-2 ~ 58 imigangatho / Umqhubi we-Pilot: i-64 layers
Max.Ukutyeba Ukuveliswa kobunzima: 394mil (10mm) / Umqhubi womqhubi: 17.5mm
Izinto eziphathekayo I-FR-4 (i-Standard FR4, i-Mid-Tg FR4, i-Hi-Tg FR4, i-Lead free assembly material) , i-Halogen-Free, i-Ceramic egcweleyo, i-Teflon, i-Polyimide, i-BT, i-PPO, i-PPE, i-Hybrid, i-Hybrid hybrid, njl njl.
Min.Ububanzi/Isithuba Umaleko wangaphakathi: 3mil/3mil (HOZ), Umaleko wangaphandle: 4mil/4mil(1OZ)
Max.Ukutyeba kobhedu Isiqinisekiso se-UL: 6.0 OZ / Umqhubi wePilot: 12OZ
Min.Ubungakanani bomngxuma Uqheliso lobumatshini: 8mil(0.2mm) I-Laser drill: 3mil(0.075mm)
Max.Ubungakanani bephaneli 1150mm × 560mm
Umgangatho wento 18:1
Umphezulu Gqiba HASL,Igolide yokuntywiliselwa, iTin yokuntywiliselwa, iOSP, ENIG + OSP, iSilver yokuntywiliselwa, iENEPIG, uMnwe weGolide
Inkqubo ekhethekileyo Umngxuma oGqwebileyo, umngxuma oyimfama, ukuxhathisa okuThunyiweyo, amandla aHlangeneyo, iHybrid, ingxubevange engaphelelanga, ingxinano ephezulu ngokuyinxenye, ukugrumba ngasemva, kunye nolawulo lokuxhathisa
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